Original 45nm Intel® Core™ Microarchitecture

  Section 7 of 10  

Mobility Thin and Small Form-Factor Packaging for Intel® Processors Based on Original 45nm Intel Core™ Microarchitecture

CONCLUSION

By coordinating the roles and workflow of the geographically distributed team members, this small group was able to deliver the Penryn family of processors’ 3-MB design implemented with the lowest possible package layer count and capacitors, returning significant cost savings over the life of the product. Likewise, the team was able to leverage this design strategy to tape out the first mainstream SFF mobility product in just nine weeks, despite the challenge of pinmap definition and bottom-up package design, thus enabling customers to design both smaller and thinner form-factor platforms.

  Section 7 of 10  

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