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Original 45nm Intel® Core™ Microarchitecture
Section 10 of 12 
The Technical Challenges of Transitioning Intel® PRO/Wireless Solutions to a Half-Mini Card
ACKNOWLEDGEMENTS
The work described in the paper was made possible by the contributions, guidance, and comments of several people. We acknowledge Jacob Solomon, Navtej Singh, and the reviewers.
A special thanks to all the teams and team members that spent many long hours to make the launch of the Intel Centrino Duo mobile technology PRO/Wireless 5000 family of network connection solutions a reality.
Section 10 of 12
In this article
- Abstract
- Introduction
- Developing the PCI Express Half-Mini Card specification
- Intel® PROWireless 5000
- Technical challenges and solutions
- Required PCB technology
- Silicon partitioning and connectivity on the PCB
- Actual implementation of Intel® PROWireless 5300
- Conclusion
- Acknowledgement
- References
- Authors’ Biographies
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