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Original 45nm Intel® Core™ Microarchitecture
Section 11 of 12 
The Technical Challenges of Transitioning Intel® PRO/Wireless Solutions to a Half-Mini Card
REFERENCES
[1] “PCI Express* Card Mini Card Electromechanical Specification.” Revision 1.2. PCI-SIG 2007.
[2] “Sectional Design Standard for High Density Interconnect (HDI) Printed Boards.” IPC-2226, April 2003.
[3] “Sectional Design Standard for Rigid Organic Printed Boards.” ANSI/IPC-2222, February 1998.
Section 11 of 12
In this article
- Abstract
- Introduction
- Developing the PCI Express Half-Mini Card specification
- Intel® PROWireless 5000
- Technical challenges and solutions
- Required PCB technology
- Silicon partitioning and connectivity on the PCB
- Actual implementation of Intel® PROWireless 5300
- Conclusion
- Acknowledgement
- References
- Authors’ Biographies
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