Original 45nm Intel® Core™ Microarchitecture

Greater Mobility Through Lower Power

David W. Browning, Mobile Platform Group, Intel Corporation

Eric DiStefano, Mobile Platform Group, Intel Corporation

Index words: TDP, thermal design power, platform, chassis, cooling, industrial design

Citations for this paper: David W. Browning, Eric DiStefano "Original 45nm Intel® Core™2 Processor Performance" Intel Technology Journal.http://www.intel.com/technology/itj/2008/
v12i3/6-paper/1-abstract.htm (October 2008).

ABSTRACT

Mobile Original Equipment Manufacturers (OEMs) place great emphasis on creating unique system designs to differentiate themselves in the mobile market. Intel Corporation's introduction of low-power, high-performance Intel® processors based on original 45nm Intel® Core™ microarchitecture, originally referred to by the codename Penryn, brings a new level of opportunity for differentiation into the mainstream segment without sacrificing performance. The Mobile Penryn family of processors offer mainstream performance at 25 watts (W) Thermal Design Power (TDP), 10 W less than previous-generation processors. This paper focuses on those attributes of design that are enhanced by the Penryn family of processors: thickness, temperature, and noise level. These processors allow thinner, cooler, and quieter systems, and they offer the end-user a more satisfying mobile computing experience.

In this paper we discuss the fundamentals of system cooling capabilities in any given form factor and look at how power relates to the thinner, cooler, and quieter systems. In the end, both Intel and OEMs ‘win’ when Intel provides the options to allow OEMs to enhance their overall system designs without sacrificing performance and thereby enhance their brand in more systems.

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