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Original 45nm Intel® Core™ Microarchitecture
Greater Mobility Through Lower Power
ACKNOWLEDGEMENTS
We thank the following people for assistance in developing the underlying work behind this paper: Bijendra Singh and Sridhar Machiroutu for thermal simulation and guidance, Eric Baugh for acoustics data and guidance, and Jarvis Leung, Michael Bitan, Ali Muhtaroglu, and Tawfik Arabi for low-power product implementation and leadership.
